Comparison Dimensions

QSFP-DD

OSFP

QSFP112

Number of Channels

8 Channels (dual-density design)

8 Channels

4 Channels
(double the speed of a single channel)

Single Channel Rate

25G NRZ / 50G PAM4
( 400G aggregated )

50G PAM4
(some solutions support 100G PAM4 )

112G PAM4
(nominal speed 106.25Gbps )

Size

Width increased by 18.35 mm, depth increased by approximately 5.9 mm.

Width 22.58mm , Depth 100.4mm (
Largest Volume)

Same
as QSFP28 (width 18.35 mm , depth 72.4 mm )

Heat Dissipation Capacity

Dependent on device fan, heat capacity 12W

Integrated metal heat sink top cover, supports high power consumption modules >15W

Low power consumption ( <10W ), relies on external heat dissipation

Compatibility

Compatible with QSFP+/QSFP28 slots
(adapter required)

Requires a dedicated OSFP slot and is not compatible with the QSFP ecosystem.

Only supports 400G/800G devices, no backward compatibility.

Typical Power Consumption

8-12W

12-15W
(High-power modules can reach 20W+ )

<10W
(significant advantage in low power consumption)

Core Application Cenarios

Data center internal interconnect (Spine/Leaf), 5G bearer network

AI cluster interconnection, high-performance computing, and telecommunications core networks

Edge computing, direct server connection, DPU/ NIC

Technological Evolution Direction

Compatibility is a priority, supporting a smooth transition from 400G to 800G.

Targeting 800G/1.6T, enhanced heat dissipation and power supply.

Focusing on 400G short-range transmission, optimizing space and power consumption.

Cost Advantage

Mature ecosystem, low upgrade costs

The module is costly (due to its complex heat dissipation design).

The compact design reduces material costs, but requires new equipment support.